C. S. Chou, W. C. J. Wei, B. H. Liu, A. B. Wang, R. C. Luo. Cu-based alloys for 3DP by melt extrusion process. In IEEE International Conference on Industrial Technology, ICIT 2016, Taipei, Taiwan, March 14-17, 2016. pages 1152-1157, IEEE, 2016. [doi]
@inproceedings{ChouWLWL16,
title = {Cu-based alloys for 3DP by melt extrusion process},
author = {C. S. Chou and W. C. J. Wei and B. H. Liu and A. B. Wang and R. C. Luo},
year = {2016},
doi = {10.1109/ICIT.2016.7474918},
url = {https://doi.org/10.1109/ICIT.2016.7474918},
researchr = {https://researchr.org/publication/ChouWLWL16},
cites = {0},
citedby = {0},
pages = {1152-1157},
booktitle = {IEEE International Conference on Industrial Technology, ICIT 2016, Taipei, Taiwan, March 14-17, 2016},
publisher = {IEEE},
isbn = {978-1-4673-8075-1},
}