Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects

Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan. Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. In Iris Hui-Ru Jiang, Gracieli Posser, editors, Proceedings of the 2024 International Symposium on Physical Design, ISPD 2024, Taipei, Taiwan, March 12-15, 2024. pages 85-90, ACM, 2024. [doi]

Abstract

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