Jun-Ho Choy, Valeriy Sukharev, Armen Kteyan, Henrik Hovsepyan, Ramnath Venkatraman, Ruggero Castagnetti. Post placement leakage reduction with stress-enhanced filler cells. In IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2015, Rome, Italy, July 22-24, 2015. pages 303-308, IEEE, 2015. [doi]
@inproceedings{ChoySKHVC15,
title = {Post placement leakage reduction with stress-enhanced filler cells},
author = {Jun-Ho Choy and Valeriy Sukharev and Armen Kteyan and Henrik Hovsepyan and Ramnath Venkatraman and Ruggero Castagnetti},
year = {2015},
doi = {10.1109/ISLPED.2015.7273531},
url = {http://dx.doi.org/10.1109/ISLPED.2015.7273531},
researchr = {https://researchr.org/publication/ChoySKHVC15},
cites = {0},
citedby = {0},
pages = {303-308},
booktitle = {IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2015, Rome, Italy, July 22-24, 2015},
publisher = {IEEE},
isbn = {978-1-4673-8009-6},
}