Flexible packed stencil design with multiple shaping apertures for e-beam lithography

Chris Chu, Wai-Kei Mak. Flexible packed stencil design with multiple shaping apertures for e-beam lithography. In 19th Asia and South Pacific Design Automation Conference, ASP-DAC 2014, Singapore, January 20-23, 2014. pages 137-142, IEEE, 2014. [doi]

Abstract

Abstract is missing.