Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho. Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. In 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020. pages 1-4, IEEE, 2020. [doi]
Abstract is missing.