Min-Hsuan Chung, Je-Wei Chuang, Yao-Wen Chang. Any-Angle Routing for Redistribution Layers in 2.5D IC Packages. In 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023. pages 1-6, IEEE, 2023. [doi]
@inproceedings{ChungCC23,
title = {Any-Angle Routing for Redistribution Layers in 2.5D IC Packages},
author = {Min-Hsuan Chung and Je-Wei Chuang and Yao-Wen Chang},
year = {2023},
doi = {10.1109/DAC56929.2023.10247899},
url = {https://doi.org/10.1109/DAC56929.2023.10247899},
researchr = {https://researchr.org/publication/ChungCC23},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023},
publisher = {IEEE},
isbn = {979-8-3503-2348-1},
}