Min-Hsuan Chung, Je-Wei Chuang, Yao-Wen Chang. Any-Angle Routing for Redistribution Layers in 2.5D IC Packages. In 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023. pages 1-6, IEEE, 2023. [doi]
Abstract is missing.