Yann Civale, Marcel Gonzalez, Deniz Sabuncuoglu Tezcan, Youssef Travaly, Philippe Soussan, Eric Beyne. A novel concept for ultra-low capacitance via-last TSV. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-4, IEEE, 2010. [doi]
Abstract is missing.