Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits - researchr publication authors

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Yann Civale, Herman Meynen, Ranjith S. E. John, Peng-Fei Fu, Craig R. Yeakle, Sheng Wang, Stefan Krausse, Thomas Rapps, Stefan Lutter. Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-5, IEEE, 2013. [doi]

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