Yann Civale, Herman Meynen, Ranjith S. E. John, Peng-Fei Fu, Craig R. Yeakle, Sheng Wang, Stefan Krausse, Thomas Rapps, Stefan Lutter. Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-5, IEEE, 2013. [doi]
@inproceedings{CivaleMJFYWKRL13,
title = {Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits},
author = {Yann Civale and Herman Meynen and Ranjith S. E. John and Peng-Fei Fu and Craig R. Yeakle and Sheng Wang and Stefan Krausse and Thomas Rapps and Stefan Lutter},
year = {2013},
doi = {10.1109/3DIC.2013.6702330},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702330},
researchr = {https://researchr.org/publication/CivaleMJFYWKRL13},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}