Michael B. Cohn, Ryan Roehnelt, Ji-Hai Xu, Alexander Shteinberg, Steven Cheung. MEMS packaging on a budget (fiscal and thermal). In Proceedings of the 2002 9th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2002, Dubrovnik, Croatia, September 15-18, 2002. pages 287-290, IEEE, 2002. [doi]
Abstract is missing.