Jason Cong, Cheng-Kok Koh, Patrick H. Madden. Interconnect layout optimization under higher order RLC model forMCM designs. IEEE Trans. on CAD of Integrated Circuits and Systems, 20(12):1455-1463, 2001. [doi]
@article{CongKM01,
title = {Interconnect layout optimization under higher order RLC model forMCM designs},
author = {Jason Cong and Cheng-Kok Koh and Patrick H. Madden},
year = {2001},
doi = {10.1109/43.969438},
url = {http://doi.ieeecomputersociety.org/10.1109/43.969438},
tags = {optimization, layout},
researchr = {https://researchr.org/publication/CongKM01},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {20},
number = {12},
pages = {1455-1463},
}