Thermal-Aware 3D IC Placement Via Transformation - researchr publication authors

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Jason Cong, Guojie Luo, Jie Wei, Yan Zhang. Thermal-Aware 3D IC Placement Via Transformation. In Proceedings of the 12th Conference on Asia South Pacific Design Automation, ASP-DAC 2007, Yokohama, Japan, January 23-26, 2007. pages 780-785, IEEE, 2007. [doi]

This author has not been identified. Look up 'Jason Cong' in GoogleIdentified as Guojie Luo This author has not been identified. Look up 'Jie Wei' in GoogleThis author has not been identified. Look up 'Yan Zhang' in Google

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