Jason Cong, Guojie Luo, Jie Wei, Yan Zhang. Thermal-Aware 3D IC Placement Via Transformation. In Proceedings of the 12th Conference on Asia South Pacific Design Automation, ASP-DAC 2007, Yokohama, Japan, January 23-26, 2007. pages 780-785, IEEE, 2007. [doi]
Abstract is missing.