Ming Cong, Yumin Zhou, Ying Jiang, Renke Kang, Dongming Guo. An automated wafer-handling system based on the integrated circuit equipments. In IEEE International Conference on Robotics and Biomimetics, ROBIO 2005, Shatin, N.T. China, 5-9 July 2005. pages 240-245, IEEE, 2005. [doi]
@inproceedings{CongZJKG05, title = {An automated wafer-handling system based on the integrated circuit equipments}, author = {Ming Cong and Yumin Zhou and Ying Jiang and Renke Kang and Dongming Guo}, year = {2005}, doi = {10.1109/ROBIO.2005.246270}, url = {http://dx.doi.org/10.1109/ROBIO.2005.246270}, researchr = {https://researchr.org/publication/CongZJKG05}, cites = {0}, citedby = {0}, pages = {240-245}, booktitle = {IEEE International Conference on Robotics and Biomimetics, ROBIO 2005, Shatin, N.T. China, 5-9 July 2005}, publisher = {IEEE}, isbn = {0-7803-9315-5}, }