Affordable and Comprehensive Testing of 3-D Stacked Die Devices - researchr publication authors

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Jean-François Côté, Jeff Fan, Sean Shen, Givargis Danialy 0001, Marcin Lipinski, Michael Garbers, Wu Yang, Martin Keim, Andreas Glowatz, Joe Reynick, Ayush Patel, Joanna Michna. Affordable and Comprehensive Testing of 3-D Stacked Die Devices. IEEE Design & Test of Computers, 39(5):17-25, 2022. [doi]

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