Affordable and Comprehensive Testing of 3-D Stacked Die Devices

Jean-François Côté, Jeff Fan, Sean Shen, Givargis Danialy 0001, Marcin Lipinski, Michael Garbers, Wu Yang, Martin Keim, Andreas Glowatz, Joe Reynick, Ayush Patel, Joanna Michna. Affordable and Comprehensive Testing of 3-D Stacked Die Devices. IEEE Design & Test of Computers, 39(5):17-25, 2022. [doi]

@article{CoteFSDLGYKGRPM22,
  title = {Affordable and Comprehensive Testing of 3-D Stacked Die Devices},
  author = {Jean-François Côté and Jeff Fan and Sean Shen and Givargis Danialy 0001 and Marcin Lipinski and Michael Garbers and Wu Yang and Martin Keim and Andreas Glowatz and Joe Reynick and Ayush Patel and Joanna Michna},
  year = {2022},
  doi = {10.1109/MDAT.2022.3191016},
  url = {https://doi.org/10.1109/MDAT.2022.3191016},
  researchr = {https://researchr.org/publication/CoteFSDLGYKGRPM22},
  cites = {0},
  citedby = {0},
  journal = {IEEE Design & Test of Computers},
  volume = {39},
  number = {5},
  pages = {17-25},
}