Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, M. Gonzalez, Ingrid De Wolf, Zsolt Tokei, Eric Beyne. Stress mitigation of 3D-stacking/packaging induced stresses. In IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018. pages 4, IEEE, 2018. [doi]
Abstract is missing.