3D Thermal-aware floorplanner for many-core single-chip systems

David Cuesta, José L. Risco-Martín, José L. Ayala, David Atienza. 3D Thermal-aware floorplanner for many-core single-chip systems. In 12th Latin American Test Workshop, LATW 2011, Beach of Porto de Galinhas, Brazil, March 27-30, 2011. pages 1-6, IEEE, 2011. [doi]

Abstract

Abstract is missing.