Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs

Ravinder Dahiya, Nivasan Yogeswaran, Fengyuan Liu, Libu Manjakkal, Etienne Burdet, Vincent Hayward, Henrik Jörntell. Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs. Proceedings of the IEEE, 107(10):2016-2033, 2019. [doi]

Authors

Ravinder Dahiya

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Nivasan Yogeswaran

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Fengyuan Liu

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Libu Manjakkal

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Etienne Burdet

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Vincent Hayward

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Henrik Jörntell

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