Ravinder Dahiya, Nivasan Yogeswaran, Fengyuan Liu, Libu Manjakkal, Etienne Burdet, Vincent Hayward, Henrik Jörntell. Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs. Proceedings of the IEEE, 107(10):2016-2033, 2019. [doi]
@article{DahiyaYLMBHJ19,
title = {Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs},
author = {Ravinder Dahiya and Nivasan Yogeswaran and Fengyuan Liu and Libu Manjakkal and Etienne Burdet and Vincent Hayward and Henrik Jörntell},
year = {2019},
doi = {10.1109/JPROC.2019.2941366},
url = {https://doi.org/10.1109/JPROC.2019.2941366},
researchr = {https://researchr.org/publication/DahiyaYLMBHJ19},
cites = {0},
citedby = {0},
journal = {Proceedings of the IEEE},
volume = {107},
number = {10},
pages = {2016-2033},
}