High-Throughput Hardware Implementation for Haraka in SPHINCS+

Yueqin Dai, Yifeng Song, Jing Tian 0004, Zhongfeng Wang 0001. High-Throughput Hardware Implementation for Haraka in SPHINCS+. In 24th International Symposium on Quality Electronic Design, ISQED 2023, San Francisco, CA, USA, April 5-7, 2023. pages 1-6, IEEE, 2023. [doi]

Authors

Yueqin Dai

This author has not been identified. Look up 'Yueqin Dai' in Google

Yifeng Song

This author has not been identified. Look up 'Yifeng Song' in Google

Jing Tian 0004

This author has not been identified. Look up 'Jing Tian 0004' in Google

Zhongfeng Wang 0001

This author has not been identified. Look up 'Zhongfeng Wang 0001' in Google