Yueqin Dai, Yifeng Song, Jing Tian 0004, Zhongfeng Wang 0001. High-Throughput Hardware Implementation for Haraka in SPHINCS+. In 24th International Symposium on Quality Electronic Design, ISQED 2023, San Francisco, CA, USA, April 5-7, 2023. pages 1-6, IEEE, 2023. [doi]
@inproceedings{DaiS0023,
title = {High-Throughput Hardware Implementation for Haraka in SPHINCS+},
author = {Yueqin Dai and Yifeng Song and Jing Tian 0004 and Zhongfeng Wang 0001},
year = {2023},
doi = {10.1109/ISQED57927.2023.10129310},
url = {https://doi.org/10.1109/ISQED57927.2023.10129310},
researchr = {https://researchr.org/publication/DaiS0023},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {24th International Symposium on Quality Electronic Design, ISQED 2023, San Francisco, CA, USA, April 5-7, 2023},
publisher = {IEEE},
isbn = {979-8-3503-3475-3},
}