Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise - researchr publication authors

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Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty. Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise. In David Atienza, Giorgio Di Natale, editors, Design, Automation & Test in Europe Conference & Exhibition, DATE 2017, Lausanne, Switzerland, March 27-31, 2017. pages 1366-1371, IEEE, 2017. [doi]

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