Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty. Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise. In David Atienza, Giorgio Di Natale, editors, Design, Automation & Test in Europe Conference & Exhibition, DATE 2017, Lausanne, Switzerland, March 27-31, 2017. pages 1366-1371, IEEE, 2017. [doi]
@inproceedings{DasDPC17-0,
title = {Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise},
author = {Sourav Das and Janardhan Rao Doppa and Partha Pratim Pande and Krishnendu Chakrabarty},
year = {2017},
doi = {10.23919/DATE.2017.7927205},
url = {https://doi.org/10.23919/DATE.2017.7927205},
researchr = {https://researchr.org/publication/DasDPC17-0},
cites = {0},
citedby = {0},
pages = {1366-1371},
booktitle = {Design, Automation & Test in Europe Conference & Exhibition, DATE 2017, Lausanne, Switzerland, March 27-31, 2017},
editor = {David Atienza and Giorgio Di Natale},
publisher = {IEEE},
isbn = {978-3-9815370-8-6},
}