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Towards Robust Process Design Kits with a Scalable DevOps Quality Assurance Platform

A. Datsuk, P. Ostrovskyy, F. Vater, C. Wieden. Towards Robust Process Design Kits with a Scalable DevOps Quality Assurance Platform. In 31st IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Dubai, United Arab Emirates, October 16-18, 2023. pages 1-6, IEEE, 2023. [doi]

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A. Datsuk

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P. Ostrovskyy

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F. Vater

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C. Wieden

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