A. Datsuk, P. Ostrovskyy, F. Vater, C. Wieden. Towards Robust Process Design Kits with a Scalable DevOps Quality Assurance Platform. In 31st IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Dubai, United Arab Emirates, October 16-18, 2023. pages 1-6, IEEE, 2023. [doi]
@inproceedings{DatsukOVW23,
title = {Towards Robust Process Design Kits with a Scalable DevOps Quality Assurance Platform},
author = {A. Datsuk and P. Ostrovskyy and F. Vater and C. Wieden},
year = {2023},
doi = {10.1109/VLSI-SoC57769.2023.10321846},
url = {https://doi.org/10.1109/VLSI-SoC57769.2023.10321846},
researchr = {https://researchr.org/publication/DatsukOVW23},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {31st IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Dubai, United Arab Emirates, October 16-18, 2023},
publisher = {IEEE},
isbn = {979-8-3503-2599-7},
}