3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Stuart Daudlin, Anthony Rizzo, Nathan C. Abrams, SunWoo Lee, Devesh Khilwani, Vaishnavi Murthy, James Robinson, Terence Collier, Alyosha C. Molnar, Keren Bergman. 3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects. In Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021. pages 1-3, IEEE, 2021. [doi]

This author has not been identified. Look up 'Stuart Daudlin' in GoogleThis author has not been identified. Look up 'Anthony Rizzo' in GoogleThis author has not been identified. Look up 'Nathan C. Abrams' in GoogleThis author has not been identified. Look up 'SunWoo Lee' in GoogleThis author has not been identified. Look up 'Devesh Khilwani' in GoogleThis author has not been identified. Look up 'Vaishnavi Murthy' in GoogleThis author has not been identified. Look up 'James Robinson' in GoogleThis author has not been identified. Look up 'Terence Collier' in GoogleThis author has not been identified. Look up 'Alyosha C. Molnar' in GoogleThis author has not been identified. Look up 'Keren Bergman' in Google

runs on WebDSL