Stuart Daudlin, Anthony Rizzo, Nathan C. Abrams, SunWoo Lee, Devesh Khilwani, Vaishnavi Murthy, James Robinson, Terence Collier, Alyosha C. Molnar, Keren Bergman. 3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects. In Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021. pages 1-3, IEEE, 2021. [doi]
Abstract is missing.