Stuart Daudlin, Anthony Rizzo, Nathan C. Abrams, SunWoo Lee, Devesh Khilwani, Vaishnavi Murthy, James Robinson, Terence Collier, Alyosha C. Molnar, Keren Bergman. 3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects. In Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021. pages 1-3, IEEE, 2021. [doi]
@inproceedings{DaudlinRALKMRCM21,
title = {3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects},
author = {Stuart Daudlin and Anthony Rizzo and Nathan C. Abrams and SunWoo Lee and Devesh Khilwani and Vaishnavi Murthy and James Robinson and Terence Collier and Alyosha C. Molnar and Keren Bergman},
year = {2021},
url = {https://ieeexplore.ieee.org/document/9489606},
researchr = {https://researchr.org/publication/DaudlinRALKMRCM21},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021},
publisher = {IEEE},
isbn = {978-1-943580-86-6},
}