W. Rhett Davis, John Wilson, Stephen Mick, Jian Xu, Hao Hua, Christopher Mineo, Ambarish M. Sule, Michael Steer, Paul D. Franzon. Demystifying 3D ICs: The Pros and Cons of Going Vertical. IEEE Design & Test of Computers, 22(6):498-510, 2005. [doi]
@article{DavisWMXHMSSF05,
title = {Demystifying 3D ICs: The Pros and Cons of Going Vertical},
author = {W. Rhett Davis and John Wilson and Stephen Mick and Jian Xu and Hao Hua and Christopher Mineo and Ambarish M. Sule and Michael Steer and Paul D. Franzon},
year = {2005},
doi = {10.1109/MDT.2005.136},
url = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.136},
researchr = {https://researchr.org/publication/DavisWMXHMSSF05},
cites = {0},
citedby = {0},
journal = {IEEE Design & Test of Computers},
volume = {22},
number = {6},
pages = {498-510},
}