Demystifying 3D ICs: The Pros and Cons of Going Vertical

W. Rhett Davis, John Wilson, Stephen Mick, Jian Xu, Hao Hua, Christopher Mineo, Ambarish M. Sule, Michael Steer, Paul D. Franzon. Demystifying 3D ICs: The Pros and Cons of Going Vertical. IEEE Design & Test of Computers, 22(6):498-510, 2005. [doi]

Abstract

Abstract is missing.