Libao Deng, Ning Sun, Ning Fu. Boundary scan based interconnect testing design for silicon interposer in 2.5D ICs. Integration, 72:171-182, 2020. [doi]
@article{DengSF20,
title = {Boundary scan based interconnect testing design for silicon interposer in 2.5D ICs},
author = {Libao Deng and Ning Sun and Ning Fu},
year = {2020},
doi = {10.1016/j.vlsi.2020.02.006},
url = {https://doi.org/10.1016/j.vlsi.2020.02.006},
researchr = {https://researchr.org/publication/DengSF20},
cites = {0},
citedby = {0},
journal = {Integration},
volume = {72},
pages = {171-182},
}