Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration

Yixiao Ding, Chris Chu, Wai-Kei Mak. Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration. IEEE Trans. on CAD of Integrated Circuits and Systems, 37(3):657-668, 2018. [doi]

Possibly Related Publications

The following publications are possibly variants of this publication: