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Yixiao Ding, Chris Chu, Wai-Kei Mak. Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration. IEEE Trans. on CAD of Integrated Circuits and Systems, 37(3):657-668, 2018. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Self-aligned double patterning-aware detailed routing with double via insertion and via manufacturability considerationYixiao Ding, Chris C. N. Chu, Wai-Kei Mak. dac 2016: 42 [doi] Self-Aligned Double Patterning Lithography Aware Detailed Routing With Color PreassignmentYixiao Ding, Chris Chu, Wai-Kei Mak. tcad, 36(8):1381-1394, 2017. [doi]
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