Curing kinetics of a novel commercial epoxy-phenolic composite build-up film for flip-chip ball grid array (FCBGA) substrates

Shanjun Ding, Jingyi Zhao, Xiaomeng Wu, Chuan Chen, Zhidan Fang, Qidong Wang. Curing kinetics of a novel commercial epoxy-phenolic composite build-up film for flip-chip ball grid array (FCBGA) substrates. Microelectronics Journal, 161:106717, 2025. [doi]

Abstract

Abstract is missing.