Chip-package codesign of a low-power 5-GHz RF front end

Stéphane Donnay, Philip Pieters, Kristof Vaesen, Wim Diels, Piet Wambacq, Walter De Raedt, Eric Beyne, Marc Engels, Ivo Bolsens. Chip-package codesign of a low-power 5-GHz RF front end. Proceedings of the IEEE, 88(10):1583-1597, 2000. [doi]

Abstract

Abstract is missing.