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Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling

Nausicaa Dornic, Ali Ibrahim, Zoubir Khatir, Son-Ha Tran, J. P. Ousten, Jeffrey Ewanchuk, Stefan Mollov. Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling. Microelectronics Reliability, 88:462-469, 2018. [doi]

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Nausicaa Dornic

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Ali Ibrahim

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Zoubir Khatir

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Son-Ha Tran

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J. P. Ousten

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Jeffrey Ewanchuk

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Stefan Mollov

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