Micro-transfer Printing of GaN HEMTs for Heterogeneous Integration and Flexible RF Circuit Design

Brian P. Downey, Andy Xie, Shawn Mack, D. Scott Katzer, James G. Champlain, Yu Cao, Neeraj Nepal, Tyler A. Growden, Vikrant J. Gokhale, Robert L. Coffie, Matthew T. Hardy, Edward Beam, Cathy Lee, David J. Meyer. Micro-transfer Printing of GaN HEMTs for Heterogeneous Integration and Flexible RF Circuit Design. In 2020 Device Research Conference, DRC 2020, Columbus, OH, USA, June 21-24, 2020. pages 1-2, IEEE, 2020. [doi]

Abstract

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