Timothy O. Drews, Sriram Krishnan, Jay Alameda, Dennis Gannon, Richard D. Braatz, Richard C. Alkire. Multiscale simulations of copper electrodeposition onto a resistive substrate. IBM Journal of Research and Development, 49(1):49-64, 2005. [doi]
@article{DrewsKAGBA05,
title = {Multiscale simulations of copper electrodeposition onto a resistive substrate},
author = {Timothy O. Drews and Sriram Krishnan and Jay Alameda and Dennis Gannon and Richard D. Braatz and Richard C. Alkire},
year = {2005},
url = {http://www.research.ibm.com/journal/rd/491/drews.pdf},
tags = {C++},
researchr = {https://researchr.org/publication/DrewsKAGBA05},
cites = {0},
citedby = {0},
journal = {IBM Journal of Research and Development},
volume = {49},
number = {1},
pages = {49-64},
}