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Timothy O. Drews, Sriram Krishnan, Jay Alameda, Dennis Gannon, Richard D. Braatz, Richard C. Alkire. Multiscale simulations of copper electrodeposition onto a resistive substrate. IBM Journal of Research and Development, 49(1):49-64, 2005. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Control systems analysis of a multiscale simulation code for copper electrodepositionEffendi Rusli, Timothy O. Drews, Richard D. Braatz. amcc 2004: 4243-4248 [doi] A hybrid multiscale kinetic Monte Carlo method for simulation of copper electrodepositionZheming Zheng, Ryan M. Stephens, Richard D. Braatz, Richard C. Alkire, Linda R. Petzold. jcphy, 227(10):5184-5199, 2008. [doi]
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