Prediction and verification of process induced warpage of electronic packages - researchr publication authors

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W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi. Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability, 43(5):765-774, 2003. [doi]

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