Prediction and verification of process induced warpage of electronic packages

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi. Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability, 43(5):765-774, 2003. [doi]

Abstract

Abstract is missing.