W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi. Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability, 43(5):765-774, 2003. [doi]
@article{DrielZJESCY03,
title = {Prediction and verification of process induced warpage of electronic packages},
author = {W. D. van Driel and G. Q. Zhang and J. H. J. Janssen and L. J. Ernst and F. Su and Kerm Sin Chian and Sung Yi},
year = {2003},
doi = {10.1016/S0026-2714(03)00057-X},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00057-X},
researchr = {https://researchr.org/publication/DrielZJESCY03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {5},
pages = {765-774},
}