Norbert Druml, Christoph Ehrenhöfer, Walter Bell, Christian Gailer, Hannes Plank, Thomas Herndl, Gerald Holweg. A fast and flexible HW/SW co-processing framework for Time-of-Flight 3D imaging. In Manfred Dietrich, Ondrej Novák, editors, 20th IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems, DDECS 2017, Dresden, Germany, April 19-21, 2017. pages 165-170, IEEE, 2017. [doi]
Abstract is missing.