3D interconnection using copper direct hybrid bonding for GaN on silicon wafer - researchr publication authors

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C. Dubarry, L. Arnaud, M. L. Calvo Munoz, Gaëlle Mauguen, S. Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier. 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-4, IEEE, 2021. [doi]

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