3D interconnection using copper direct hybrid bonding for GaN on silicon wafer - researchr publication related

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C. Dubarry, L. Arnaud, M. L. Calvo Munoz, Gaëlle Mauguen, S. Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier. 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-4, IEEE, 2021. [doi]

The following publications are possibly variants of this publication:

Chip to wafer copper direct bonding electrical characterization and thermal cyclingYann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stephane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry. 3dic 2013: 1-7 [doi]

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