Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stephane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry. Chip to wafer copper direct bonding electrical characterization and thermal cycling. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-7, IEEE, 2013. [doi]
Abstract is missing.