Integration of HfO2-based 3D OxRAM with GAA stacked-nanosheet transistor for high-density embedded memory

T. Dubreuil, S. Barraud, J.-M. Pedini, J.-M. Hartmann, F. Boulard, A. Sarrazin, A. Gharbi, Johannes Sturm, A. Lambert, S. Martin, N. Castellani, A. Anotta, A. Magalhaes-Lucas, Aurelie Souhaite, François Andrieu. Integration of HfO2-based 3D OxRAM with GAA stacked-nanosheet transistor for high-density embedded memory. In 53rd IEEE European Solid-State Device Research Conference, ESSDERC 2023, Lisbon, Portugal, September 11-14, 2023. pages 117-120, IEEE, 2023. [doi]

Authors

T. Dubreuil

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S. Barraud

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J.-M. Pedini

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J.-M. Hartmann

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F. Boulard

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A. Sarrazin

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A. Gharbi

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Johannes Sturm

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A. Lambert

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S. Martin

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N. Castellani

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A. Anotta

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A. Magalhaes-Lucas

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Aurelie Souhaite

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François Andrieu

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