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Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys

J. Eckermann, S. Mehmood, H. M. Davies, N. P. Lavery, S. G. R. Brown, J. Sienz, A. Jones, P. Sommerfeld. Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys. Microelectronics Reliability, 54(6-7):1235-1242, 2014. [doi]

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J. Eckermann

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S. Mehmood

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H. M. Davies

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N. P. Lavery

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S. G. R. Brown

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J. Sienz

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A. Jones

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P. Sommerfeld

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