J. Eckermann, S. Mehmood, H. M. Davies, N. P. Lavery, S. G. R. Brown, J. Sienz, A. Jones, P. Sommerfeld. Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys. Microelectronics Reliability, 54(6-7):1235-1242, 2014. [doi]
Abstract is missing.